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Title:
ELECTROCHEMICALLY FABRICATED STRUCTURES HAVING DIELECTRIC OR ACTIVE BASES
Document Type and Number:
WIPO Patent Application WO2003095711
Kind Code:
A3
Abstract:
Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Inventors:
THOMPSON JEFFREY A
COHEN ADAM L
LOCKARD MICHAEL S
SMALLEY DENNIS R
Application Number:
PCT/US2003/014862
Publication Date:
August 18, 2005
Filing Date:
May 07, 2003
Export Citation:
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Assignee:
MEMGEN CORP (US)
International Classes:
B81C1/00; C25D5/02; (IPC1-7): C25D1/00
Foreign References:
US6027630A2000-02-22
US5891285A1999-04-06
GB792920A1958-04-09
Other References:
COHEN A ET AL: "EFAB: rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS", MICRO ELECTRO MECHANICAL SYSTEMS, 1999. MEMS '99. TWELFTH IEEE INTERNATIONAL CONFERENCE ON ORLANDO, FL, USA 17-21 JAN. 1999, PISCATAWAY, NJ, USA,IEEE, US, 17 January 1999 (1999-01-17), pages 244 - 251, XP010321754, ISBN: 0-7803-5194-0
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 04 30 April 1996 (1996-04-30)
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 02 30 January 1998 (1998-01-30)
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