Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/089863
Kind Code:
A1
Abstract:
[Problem] To provide a low-viscosity electroconductive adhesive that can be suitably used in a jet dispenser, can maintain a constant discharge shape and a constant discharge rate, can be discharged continuously due to being unlikely to cause the clogging of a nozzle, and enables a coating film thereof to cure quickly, and provides a cured coating film that exhibits excellent bonding strength and electrical properties. [Solution] An electroconductive adhesive containing: a silver powder in which a flaky silver powder and a spherical silver powder have been mixed at a mass ratio of 40:60 to 60:40; an epoxy resin composed of an alicyclic epoxy resin and a bisphenol-A type liquid epoxy resin; and a curing agent, wherein the electroconductive adhesive has a silver powder content of 75-85 parts by mass and a thixotropy of 2.0-3.0.
Inventors:
FURUTANI TETSURO (JP)
Application Number:
PCT/JP2022/026546
Publication Date:
May 25, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD (JP)
International Classes:
C08G59/18; C09J9/02; C09J11/04; C09J11/06; C09J163/02; H01B1/00; H01B1/22
Foreign References:
| JP2013196953A | 2013-09-30 | |||
| JP2017020047A | 2017-01-26 | |||
| JP2016048807A | 2016-04-07 | |||
| JP2018037526A | 2018-03-08 |
Attorney, Agent or Firm:
MAEKAWA Makiko et al. (JP)
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