Title:
ELECTROCONDUCTIVE FILM FOR CIRCUIT SUBSTRATE, AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM FOR CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/149007
Kind Code:
A1
Abstract:
An electroconductive film for a circuit substrate, comprising a base material and a laminate provided to at least one surface of the base material. The laminate has a thin-film copper layer and an anti-corrosion layer in the stated order from the base-material side. The anti-corrosion layer contains an alloy of copper and nickel. Within the alloy of copper and nickel, the proportion of copper is 35-70 mass%. The average thickness of the anti-corrosion layer is 1-9 nm.
Inventors:
MITSUSHIO TATSUYA (JP)
KAWAKITA KAKO (JP)
KAWAKITA KAKO (JP)
Application Number:
PCT/JP2022/033497
Publication Date:
August 10, 2023
Filing Date:
September 07, 2022
Export Citation:
Assignee:
OIKE & CO LTD (JP)
International Classes:
H05K1/09; B32B15/08; C23C14/14; C23C14/34
Domestic Patent References:
| WO2006134868A1 | 2006-12-21 | |||
| WO2009034857A1 | 2009-03-19 |
Foreign References:
| JP2016153214A | 2016-08-25 | |||
| JP2014152344A | 2014-08-25 | |||
| JP2021035755A | 2021-03-04 |
Attorney, Agent or Firm:
ASAHINA & CO. (JP)
Download PDF:
Previous Patent: BOILER SYSTEM AND BOILER SYSTEM OPERATION METHOD
Next Patent: COMPUTER SYSTEM AND METHOD FOR ANALYZING IMPACT OF SECURITY RISK
Next Patent: COMPUTER SYSTEM AND METHOD FOR ANALYZING IMPACT OF SECURITY RISK