Title:
ELECTROCONDUCTIVE FILM COMPOSITE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/056052
Kind Code:
A1
Abstract:
Provided are an electroconductive film composite having a substrate and an electroconductive film, and a method for manufacturing the same, wherein the electroconductive film has good adhesion to the substrate and also good electroconductivity and heat resistance, even when a substrate having low heat resistance or a glass substrate is used. The present invention pertains to an electroconductive film composite characterized by having a substrate, a resin layer formed on at least a part of the substrate, and an electroconductive film formed on at least a part of the resin layer, the electroconductive film being a sintered body of silver fine particles, and the film thickness of the resin layer being 1 μm or less.
Inventors:
TOMURA TAKUYA (JP)
SHINGAI YUKI (JP)
SHINGAI YUKI (JP)
Application Number:
PCT/JP2017/032036
Publication Date:
March 29, 2018
Filing Date:
September 06, 2017
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
H01B5/14; B22F1/00; B22F1/102; H01B13/00; B22F1/16
Domestic Patent References:
| WO2016104249A1 | 2016-06-30 | |||
| WO2014115629A1 | 2014-07-31 | |||
| WO2016047359A1 | 2016-03-31 | |||
| WO2016084312A1 | 2016-06-02 | |||
| WO2015190076A1 | 2015-12-17 | |||
| WO2016152017A1 | 2016-09-29 | |||
| WO2012147815A1 | 2012-11-01 |
Foreign References:
| JP2015156459A | 2015-08-27 | |||
| JP2007329461A | 2007-12-20 | |||
| JP2009049124A | 2009-03-05 | |||
| JP2010013550A | 2010-01-21 | |||
| JP2014194057A | 2014-10-09 |
Attorney, Agent or Firm:
NAKA Koichi et al. (JP)
Download PDF: