Title:
ELECTROCONDUCTIVE FILM, CONNECTION STRUCTURE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/189416
Kind Code:
A1
Abstract:
An electroconductive film 100, in plan view, includes particle regions 30 of a prescribed surface area, disposed regularly scattered, the particle regions including a projection of one electroconductive particle 20 or a projection of an electroconductive particle group composed of a plurality of electroconductive particles 20. When the surface area of any one particle region 30 is defined as S, and the average surface area S in a field of view of at least 100×100 μm of the electroconductive film 100 as SA, the maximum value and the minimum value of the surface area S are within SA±80%.
Inventors:
WATANABE KAZUMU (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
Application Number:
PCT/JP2023/009293
Publication Date:
October 05, 2023
Filing Date:
March 10, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L21/60; H01B1/22; H01B5/16; H01R11/01
Foreign References:
| JP2002519473A | 2002-07-02 | |||
| JP2018081906A | 2018-05-24 | |||
| JP2016085982A | 2016-05-19 | |||
| JP2016171284A | 2016-09-23 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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