Title:
ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/004404
Kind Code:
A1
Abstract:
This electroconductive film (1) comprises an organic resin substrate (2), an inorganic layer (3) that is disposed on one thickness-direction side of the organic resin substrate (2), and a copper layer (4) that is disposed directly on one thickness-direction surface of the inorganic layer (3). The copper layer (4) has a boundary vicinity region (4A) that includes a boundary with the inorganic layer (3), and a boundary-distant region (4B) that is positioned on one thickness-direction surface of the boundary vicinity region (4A). In observation using a transmission electron microscope, there is a difference in contrast between the boundary vicinity region (4A) and the boundary-distant region (4B) in a cross-section of the copper layer (4).
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Inventors:
TAKESHITA SHOYA (JP)
SONE HIROKI (JP)
TAKEYASU TOMOHIRO (JP)
SONE HIROKI (JP)
TAKEYASU TOMOHIRO (JP)
Application Number:
PCT/JP2023/017919
Publication Date:
January 04, 2024
Filing Date:
May 12, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B15/04; B32B9/00; B32B15/20
Domestic Patent References:
| WO2016140073A1 | 2016-09-09 | |||
| WO2017065184A1 | 2017-04-20 |
Foreign References:
| JPH11268183A | 1999-10-05 | |||
| JPH09201900A | 1997-08-05 | |||
| JPH1034797A | 1998-02-10 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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