Title:
ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/057827
Kind Code:
A1
Abstract:
This electroconductive film comprises an electroconductive film body and a metal layer. The electroconductive film body contains a resin and an electroconductive material. The metal layer is layered on the electroconductive film body. When the electroconductive film is heated from 20°C to 80°C and then cooled from 80°C to 20°C in a test carried out using a thermomechanical analyzer (TMA), the rate of change in the machine direction (MD) dimension of the electroconductive film is −0.10% or higher. In the test, the load by which the electroconductive film is stretched is 0.0035 N, the speed of the temperature change during heating is 5.0°C/min, and the speed of the temperature change during cooling is −5.0°C/min.
Inventors:
YAMANAKA SOICHIRO (JP)
Application Number:
PCT/JP2023/029952
Publication Date:
March 21, 2024
Filing Date:
August 21, 2023
Export Citation:
Assignee:
GUNZE KK (JP)
International Classes:
B32B27/18; B32B7/025; B32B15/08; C08J7/044; C23C14/20
Foreign References:
| JP2022081130A | 2022-05-31 | |||
| JP2022081129A | 2022-05-31 | |||
| JP2021072243A | 2021-05-06 | |||
| JP2021056161A | 2021-04-08 | |||
| JP2019121707A | 2019-07-22 | |||
| JP2015096578A | 2015-05-21 |
Attorney, Agent or Firm:
FUJIWARA, Satoshi et al. (JP)
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