Title:
ELECTROCONDUCTIVE MATERIAL AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/138946
Kind Code:
A1
Abstract:
Provided is an electroconductive material in which resistance value fluctuations accompanying irradiation by sunlight are ameliorated. An electroconductive material having a mesh-form metal silver thin wire pattern on a support body, wherein the electroconductive material is characterized in having at least 1mg/m2 of elemental copper on the surface of the electroconductive material on which the mesh-form metal silver thin wire pattern is present.
Inventors:
GOKAN NORIHIKO (JP)
NISHIMURA NAOYA (JP)
NISHIMURA NAOYA (JP)
Application Number:
PCT/JP2018/048550
Publication Date:
July 18, 2019
Filing Date:
December 28, 2018
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
H01B5/14; B32B3/24; G06F3/041; G06F3/044; H01B13/00; H05K1/09
Domestic Patent References:
| WO2013157420A1 | 2013-10-24 |
Foreign References:
| JP2008218096A | 2008-09-18 | |||
| JP2009252493A | 2009-10-29 | |||
| JP2010251734A | 2010-11-04 | |||
| JP2017076206A | 2017-04-20 | |||
| JP2011054382A | 2011-03-17 | |||
| JP2008290354A | 2008-12-04 |
Attorney, Agent or Firm:
IWATANI Ryo (JP)
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