Title:
ELECTROCONDUCTIVE PASTE, SUBSTRATE EQUIPPED WITH ELECTROCONDUCTIVE FILM, AND METHOD FOR MANUFACTURING SUBSTRATE EQUIPPED WITH ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/153101
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electroconductive paste that is capable of forming an electroconductive film on a poorly heat-resistant substrate by means of light irradiation, that has no limitation in terms of sintering conditions, that exhibits superior adhesiveness with respect to a resin substrate, and that is capable of forming an electroconductive film exhibiting superior electroconductivity. The present invention provides an electroconductive paste containing copper fine particles having an average particle size of 300 nm or less, copper coarse particles having an average particle size of 3-11 μm, a binder resin, and a dispersion medium, wherein: the copper fine particles have, at least in part of the surfaces thereof, a coating containing cuprous oxide and copper carbonate; the proportion of the mass oxygen concentration with respect to the specific surface area of the copper fine particles is 0.1-1.2 mass%•g/m2; the proportion of the mass carbon concentration with respect to the specific surface area of the copper fine particles is 0.008-0.3 mass%•g/m2; and the binder-resin content is 2.5-6 parts by mass with respect to 100 parts by mass of the copper fine particles and the copper coarse particles in total.
Inventors:
MIYOSHI KENTARO (JP)
HOSOKAWA RYUHEI (JP)
IGARASHI HIROSHI (JP)
HOSOKAWA RYUHEI (JP)
IGARASHI HIROSHI (JP)
Application Number:
PCT/JP2019/051355
Publication Date:
July 30, 2020
Filing Date:
December 27, 2019
Export Citation:
Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
C09D17/00; H01B1/00; H01B1/22; H01B5/14; H01B13/00; H05K1/09; H05K3/12
Foreign References:
| JP2013161544A | 2013-08-19 | |||
| JP2018127657A | 2018-08-16 | |||
| JP2015133317A | 2015-07-23 | |||
| JPH09218508A | 1997-08-19 | |||
| JP2010528428W | ||||
| JP2008285761A | 2008-11-27 | |||
| JP2017066269A | 2017-04-06 | |||
| JP2018127657A | 2018-08-16 |
Other References:
See also references of EP 3885415A4
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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