Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2018/155393
Kind Code:
A1
Abstract:
Provided is an electroconductive paste in which, even when a bus bar electrode of a solar cell produced using a resinous electroconductive paste in which there is used a silver-coated copper powder is connected to a tab line through soldering, it is possible to prevent a decrease in conversion efficiency of the solar cell. An electroconductive paste comprising a resin and a silver-coated copper powder in which the surface of a copper powder having a cumulative 50% particle diameter (D50 diameter) based on volume measured using a laser diffraction grain size distribution device of 0.1-15 µm is coated with a silver layer, wherein an epoxy resin having a naphthalene framework is used as the resin, and preferably, at least one of imidazole and a boron trifluoride amine curing agent is added as a curing agent.
Inventors:
HIRATA AIKO (JP)
Application Number:
PCT/JP2018/005829
Publication Date:
August 30, 2018
Filing Date:
February 20, 2018
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01B1/22; C23C26/00; H01B1/00; H01L31/0224; H01L31/048; H05K1/09
Domestic Patent References:
WO2006129487A1 | 2006-12-07 | |||
WO2014203897A1 | 2014-12-24 | |||
WO2016088540A1 | 2016-06-09 |
Foreign References:
JP2010083952A | 2010-04-15 | |||
JP2007019006A | 2007-01-25 | |||
JP2011086397A | 2011-04-28 | |||
JP2012504179A | 2012-02-16 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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