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Title:
ELECTROCONDUCTIVE SHEET AND DICING/DIE BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2022/264546
Kind Code:
A1
Abstract:
This electroconductive sheet comprises a binder resin and electroconductive particles, and has a 70°C viscosity of 10-10,000 kPa·s and a 70°C elongation at break of 110% or higher.

Inventors:
MITA RYOTA (JP)
ICHIKAWA TOMOAKI (JP)
OKOBA YUICHI (JP)
Application Number:
PCT/JP2022/009950
Publication Date:
December 22, 2022
Filing Date:
March 08, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/301; H01L21/52
Domestic Patent References:
WO2019092959A12019-05-16
WO2018179796A12018-10-04
WO2020189535A12020-09-24
WO2015056303A12015-04-23
Foreign References:
JP2011071492A2011-04-07
JP2015195266A2015-11-05
JP2015008307A2015-01-15
JP2021077766A2021-05-20
JP2017045935A2017-03-02
JP2012079936A2012-04-19
JP2016125043A2016-07-11
JP2019104862A2019-06-27
JP2016103524A2016-06-02
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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