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Title:
ELECTRODE BODY
Document Type and Number:
WIPO Patent Application WO/2015/068439
Kind Code:
A1
Abstract:
　An electrode body in a semiconductor device (10) is provided with: an electrode film (1) containing aluminum; a barrier metal film (2) containing titanium, the barrier metal film (2) being disposed below the electrode film (1); and a bonding film (3) containing silicon, the bonding film (3) being disposed below the barrier metal film (2). The film thickness (t1) of the electrode film (1) and the film thickness (t2) of the barrier metal film (2) satisfy the relationship t1 ≥ 6.67 × t2 + 3500.

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Inventors:
KUWANO SATOSHI
Application Number:
PCT/JP2014/070518
Publication Date:
May 14, 2015
Filing Date:
August 04, 2014
Export Citation:
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Assignee:
TOYOTA MOTOR CO LTD (JP)
KUWANO SATOSHI
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Foreign References:
JPH08203952A1996-08-09
JPH1137022A1999-02-09
JP2008071918A2008-03-27
JPH08250540A1996-09-27
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
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