Title:
ELECTRODE MATERIAL HAVING CLAD STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/141273
Kind Code:
A1
Abstract:
An electrode material which constitutes a movable electrode (50) in a thermal cutout (1) and which has a clad structure formed by joining a base layer consisting of Cu or a Cu alloy to a contact layer consisting of an Ag-CuO based oxide-dispersion -strengthened alloy. The present invention is an electrode material which is suitable for a movable electrode for a thermal cutout and which can solve the problem of poor contacting with a case, said poor contacting being due to long-term use. In order to improve the contact resistance between the electrode (50) and a case (10), it is preferable that the electrode material has a contact layer which consists of Ag and which is joined to the reverse side of the base layer.
Inventors:
MATSUO HIROSHI (JP)
WADA RYOE (JP)
WADA RYOE (JP)
Application Number:
PCT/JP2013/057986
Publication Date:
September 26, 2013
Filing Date:
March 21, 2013
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
H01H37/76; C22C5/06; C22C9/00; C22C9/02; C22C9/06; C22C32/00
Domestic Patent References:
| WO2003009323A1 | 2003-01-30 |
Foreign References:
| JPH025844U | 1990-01-16 | |||
| JPS56169320U | 1981-12-15 | |||
| JPH0547252A | 1993-02-26 | |||
| JP2011137198A | 2011-07-14 | |||
| JPH10162704A | 1998-06-19 | |||
| JPH01166436A | 1989-06-30 | |||
| JPH06170557A | 1994-06-21 | |||
| JP2011137198A | 2011-07-14 |
Other References:
See also references of EP 2830080A1
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
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