Title:
ELECTRODE PLATE FOR PLASMA TREATMENT DEVICE AND ELECTRODE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/009903
Kind Code:
A1
Abstract:
This electrode plate (3) for a plasma treatment device is disposed on an electrode contact surface (142) side of a cooling plate (14). The electrode plate (3) comprises a downstream gas flow channel (11) connected to an upstream gas flow channel (15) that penetrates the electrode contact surface (142) from one surface (141) of the cooling plate (14). Corrosion resistant membranes (210, 230), which are resistant to a process gas that flows in the upstream gas flow channel (15) of the cooling plate (14), are formed on a first surface (31) that is in contact with the cooling plate (14) as a result of providing an inlet (111) which is a section of the downstream gas flow channel (11).
Inventors:
MORI RIE (JP)
KATO SHINJI (JP)
KATO SHINJI (JP)
Application Number:
PCT/JP2023/024374
Publication Date:
January 11, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L21/3065; C23C16/44; C23C16/50; H05H1/46
Domestic Patent References:
| WO2021182107A1 | 2021-09-16 |
Foreign References:
| JP2007123796A | 2007-05-17 | |||
| JP2004342704A | 2004-12-02 | |||
| JP2001274103A | 2001-10-05 | |||
| JP2015029132A | 2015-02-12 | |||
| JP2007227789A | 2007-09-06 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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