Title:
ELECTRODE UNIT MANUFACTURING DEVICE, AND ELECTRODE UNIT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/100453
Kind Code:
A1
Abstract:
An electrode unit manufacturing device 50 for manufacturing an electrode unit 11A by welding a resin member 21B to a bipolar electrode 11 including a current collector 15 and active material layers provided on one surface 15a and another surface 15b of the current collector 15 comprises: a robot hand 30 for transporting the bipolar electrode 11 in the air while holding the same by suction attachment; and a welding device 40 including a welding unit 45 for welding the resin member 21B to the bipolar electrode 11 that is being held in the air by suction attachment by the robot hand 30.
Inventors:
KINUGAWA TATSUYA (JP)
KOYAMA TETSUYA (JP)
MATSUMOTO NORIYUKI (JP)
KOYAMA TETSUYA (JP)
MATSUMOTO NORIYUKI (JP)
Application Number:
PCT/JP2022/035717
Publication Date:
June 08, 2023
Filing Date:
September 26, 2022
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
International Classes:
H01M4/139; H01G11/86; H01G13/00; H01M4/04; H01M10/04; H01M10/052; H01M10/0585
Foreign References:
| JP2019133797A | 2019-08-08 | |||
| JP2019220315A | 2019-12-26 | |||
| JP2020095909A | 2020-06-18 | |||
| JP2007122977A | 2007-05-17 | |||
| US4164068A | 1979-08-14 | |||
| JP2010238425A | 2010-10-21 | |||
| JP2022075105A | 2022-05-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: VACUUM PROCESSING DEVICE
Next Patent: SILICON CARBIDE SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME
Next Patent: SILICON CARBIDE SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME