Title:
ELECTRODEPOSITION LIQUID, METAL CORE SUBSTRATE, AND PROCESS FOR PRODUCING METAL CORE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/043331
Kind Code:
A1
Abstract:
Provided are a metal core substrate having high thermal conductivity and high insulating properties, an electrodeposition liquid for use in producing the metal core substrate, and a process for producing the metal core substrate. The electrodeposition liquid (28) is for use in an electrophoretic electrodeposition method, and comprises a plurality of ceramic particles (28a) for coating a metallic substrate (10) and an organopolysiloxane composition for bonding the plurality of ceramic particles (28a).
Inventors:
AOKI YUSUKE (JP)
KANO MIKIHITO (JP)
KASANO KAZUHIKO (JP)
KANO MIKIHITO (JP)
KASANO KAZUHIKO (JP)
Application Number:
PCT/JP2015/076804
Publication Date:
March 24, 2016
Filing Date:
September 18, 2015
Export Citation:
Assignee:
UNIV MIE (JP)
International Classes:
C09D183/04; C09D5/44; C09D7/12; H01L23/12; H01L23/15; H05K1/05; H05K3/44
Foreign References:
JPH0586194A | 1993-04-06 | |||
JP2009043914A | 2009-02-26 | |||
JPS6353296A | 1988-03-07 | |||
JP2000345370A | 2000-12-12 | |||
JPS60207392A | 1985-10-18 | |||
JPS6320374A | 1988-01-28 |
Other References:
See also references of EP 3196263A4
Attorney, Agent or Firm:
NII, Hiromori (JP)
New house Extensive 守 (JP)
New house Extensive 守 (JP)
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