Title:
ELECTROLESS COPPER PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2022/102226
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electroless copper plating solution which has excellent solution stability and is easy to control the composition even through the electroless copper plating solution is used in a neutral range. In order to achieve this purpose, the present invention employs a reducing electroless copper plating solution which is used in a neutral range, and which is characterized by containing a copper salt that serves as a copper ion supply source, a complexing agent for chelating copper ions, a reducing agent, a surfactant, an aromatic compound that contains nitrogen, and a tellurium compound that serves as a precipitation stabilizer, while being also characterized by having a solution pH of from 6 to 9.
Inventors:
TSUKAHARA YOSHITO (JP)
NAKATA YUKI (JP)
NAKATA YUKI (JP)
Application Number:
PCT/JP2021/032487
Publication Date:
May 19, 2022
Filing Date:
September 03, 2021
Export Citation:
Assignee:
MELTEX INC (JP)
International Classes:
C23C18/40
Foreign References:
| JP2010538166A | 2010-12-09 | |||
| JP2013234343A | 2013-11-21 | |||
| JP2016517914A | 2016-06-20 | |||
| JPS53142328A | 1978-12-12 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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