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Title:
ELECTROLESS PLATING BASE FILM
Document Type and Number:
WIPO Patent Application WO/2020/196112
Kind Code:
A1
Abstract:
This electroless plating base film contains (A) a conductive polymer and (B) a reactant between a polyisocyanate compound and a polyol resin having a certain acid value, wherein the acid value is 0.1-30 mgKOH/g.

Inventors:
HACHIYA SATOSHI (JP)
FUKATSU FUMIOKI (JP)
Application Number:
PCT/JP2020/011806
Publication Date:
October 01, 2020
Filing Date:
March 17, 2020
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Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C23C18/30; B32B15/095; C23C18/38; H05K3/18; H05K3/38
Domestic Patent References:
WO2019013179A12019-01-17
WO2015019596A12015-02-12
Foreign References:
JP2015034317A2015-02-19
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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