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Title:
ELECTROLYTIC COPPER FOIL, LITHIUM ION SECONDARY CELL NEGATIVE ELECTRODE, LITHIUM ION SECONDARY CELL, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/217085
Kind Code:
A1
Abstract:
The present invention provides an electrolytic copper foil having high strength, high heat resistance, and small elongation anisotropy, a lithium ion secondary cell negative electrode, a lithium ion secondary cell, and a printed wiring board. This surface-treated copper foil is an electrolytic copper foil containing 0.001-0.020% by mass of copper, and is characterized in that the ten-point average roughness (Rz) of the electrolytic copper foil is 1.8 µm or less, the tensile strength of the electrolytic copper foil when the tensile characteristics thereof are measured at normal temperature after the copper foil is heated for 1 hour at 150°C is 400 MPa or greater, the elongation of the copper foil in the width direction (TD) thereof is 2% or greater, and the elongation anisotropy \{[(MD elongation – TD elongation)/MD elongation] × 100\} as a parameter representing the difference between the elongation of the copper foil in the longitudinal direction (MD) and the elongation thereof in the width direction (TD) is 50% or less.

Inventors:
EBISUGI MASATO (JP)
SHINOZAKI JUN (JP)
Application Number:
PCT/JP2017/014131
Publication Date:
December 21, 2017
Filing Date:
April 04, 2017
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D1/04; C22C9/00; H01G11/70; H01M4/66; H05K1/03
Domestic Patent References:
WO2012070589A12012-05-31
Foreign References:
JPH02500374A1990-02-08
JP5916904B12016-05-11
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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