Title:
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2001/016402
Kind Code:
A1
Abstract:
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that the bonding interface layer (8) comprises isocyanuric acid. The peelable electrolytic copper foil with carrier foil (3) is free from the defect of a conventional peelable electrolytic copper foil with a carrier foil that a peel adhesion is unstable with respect to the peeling of the carrier foil after the formation by hot pressing at a temperature higher than 300°C and provides a peelable electrolytic copper foil with a carrier foil which is capable of undergoing the peeling of the carrier foil with stability and by a small force.
Inventors:
KATAOKA TAKASHI (JP)
HIRASAWA YUTAKA (JP)
YAMAMOTO TAKUYA (JP)
IWAKIRI KENICHIRO (JP)
HIGUCHI TSUTOMU (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)
HIRASAWA YUTAKA (JP)
YAMAMOTO TAKUYA (JP)
IWAKIRI KENICHIRO (JP)
HIGUCHI TSUTOMU (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)
Application Number:
PCT/JP2000/005363
Publication Date:
March 08, 2001
Filing Date:
August 10, 2000
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
KATAOKA TAKASHI (JP)
HIRASAWA YUTAKA (JP)
YAMAMOTO TAKUYA (JP)
IWAKIRI KENICHIRO (JP)
HIGUCHI TSUTOMU (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)
KATAOKA TAKASHI (JP)
HIRASAWA YUTAKA (JP)
YAMAMOTO TAKUYA (JP)
IWAKIRI KENICHIRO (JP)
HIGUCHI TSUTOMU (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)
International Classes:
C07D251/32; C25D1/04; C25D1/22; C25D3/38; C25D5/54; H05K1/09; H05K3/00; H05K3/02; (IPC1-7): C25D1/22; H05K1/09
Foreign References:
| JPS63274795A | 1988-11-11 | |||
| JPH02113591A | 1990-04-25 | |||
| JPH05102630A | 1993-04-23 |
Attorney, Agent or Firm:
Tanaka, Daisuke (Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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