Title:
ELECTROLYTIC NICKEL (ALLOY) PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2018/097184
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 without the generation of defects such as voids and seams and firmly join two or more electronic components together by filling micro gaps. The present invention also addresses the problem of providing a nickel or nickel alloy plating/filling method with which an electrolytic nickel (alloy) plating solution is used, a method for producing a minute three-dimensional structure, an electronic component assembly, and a production method therefor. The problems have been solved by filling the micro holes or micro recesses 14 with an electrolytic nickel (alloy) plating solution which contains a specific N-substituted pyridinium compound.
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Inventors:
SHIBATA KAZUYA (JP)
OOHIRABARU YUKI (JP)
OOHIRABARU YUKI (JP)
Application Number:
PCT/JP2017/042024
Publication Date:
May 31, 2018
Filing Date:
November 22, 2017
Export Citation:
Assignee:
JAPAN PURE CHEMICAL CO LTD (JP)
International Classes:
C25D3/12; C25D7/00
Foreign References:
| JPH10245693A | 1998-09-14 | |||
| JPS61221394A | 1986-10-01 | |||
| US20050173254A1 | 2005-08-11 | |||
| JP2013039616A | 2013-02-28 | |||
| JP2012195465A | 2012-10-11 | |||
| JP2008308708A | 2008-12-25 | |||
| JP2005187887A | 2005-07-14 |
Attorney, Agent or Firm:
TAKAHASHI INTERNATIONAL PATENT OFFICE (JP)
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