ELECTROLYTIC SILVER PLATING SOLUTION - METALOR TECH JAPAN CORPORATION

Title:

ELECTROLYTIC SILVER PLATING SOLUTION

Document Type and Number:

WIPO Patent Application WO/2018/181190

Kind Code:

A1

Abstract:

According to the present invention, there is provided an electrolytic silver plating solution containing a silver cyanide complex, an electrically conductive salt, a selenium compound, a saturated fatty acid, and/or a salt thereof, and capable of forming a silver film with a high gloss and a high reflectance.

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Inventors:

ISEKI MASATO (JP)

Application Number:

PCT/JP2018/012161

Publication Date:

October 04, 2018

Filing Date:

March 26, 2018

Export Citation:

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Assignee:

METALOR TECH JAPAN CORPORATION (JP)

International Classes:

C25D3/46; C25D3/64

Foreign References:

JP2016145413A	2016-08-12
JP2013249514A	2013-12-12
JPS57110688A	1982-07-09
JPH0827589A	1996-01-30
JPH02270984A	1990-11-06