Title:
ELECTROLYTIC TREATMENT DEVICE AND ELECTROLYTIC TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/142955
Kind Code:
A1
Abstract:
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment part (20). The substrate retaining part (10) has a retaining base (11) having insulation properties, for retaining the treatment substrate, and an indirect negative electrode (12) to which a negative voltage is applied, the indirect negative electrode (12) being provided inside the retaining base (11). The electrolytic treatment part (20) is provided facing the substrate retaining part (10), and applies a voltage to the treatment substrate and an electrolytic solution in contact with the treatment substrate.
Inventors:
HOSHINO TOMOHISA (JP)
HAMADA MASATO (JP)
MATSUMOTO TOSHIYUKI (JP)
HAMADA MASATO (JP)
MATSUMOTO TOSHIYUKI (JP)
Application Number:
PCT/JP2018/001354
Publication Date:
August 09, 2018
Filing Date:
January 18, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C25D17/10; C25D5/18; C25D7/12; C25D17/00; C25D17/06; C25D17/08; C25D21/00; C25D21/12
Domestic Patent References:
| WO2015104951A1 | 2015-07-16 | |||
| WO2017094568A1 | 2017-06-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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