Title:
ELECTROMAGNETIC SHIELDING FILM, METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM, AND METHOD FOR MANUFACTURING SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/095919
Kind Code:
A1
Abstract:
An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprising a protective film and a pressure-sensitive-adhesive layer; the electromagnetic shielding film being characterized in that the pressure-sensitive-adhesive layer of the protective part is bonded to the adhesive layer of the shielding film part, the height c at which the load area ratio Smr(c) of the surface of the adhesive layer in contact with the pressure-sensitive-adhesive layer is 50% is 2-15 µm, and the storage modulus at 20°C of a resin constituting the pressure-sensitive-adhesive layer is 0.1-0.5 MPa.
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Inventors:
YAMAMOTO YOSHIHISA (JP)
KAMINO KENJI (JP)
KAMINO KENJI (JP)
Application Number:
PCT/JP2019/043375
Publication Date:
May 14, 2020
Filing Date:
November 06, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J9/02; B32B7/025; C09J7/35; C09J7/38; C09J201/00; H05K1/02; H05K9/00
Domestic Patent References:
| WO2014077406A1 | 2014-05-22 |
Foreign References:
| JPS6329314B2 | 1988-06-13 | |||
| JP2018166180A | 2018-10-25 | |||
| JP2018056330A | 2018-04-05 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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