Title:
ELECTROMAGNETIC WAVE ATTENUATING FILM
Document Type and Number:
WIPO Patent Application WO/2022/107637
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave attenuating film which is capable of attenuating radio waves of millimeter wave bands of frequencies and which is thin. The present invention provides an electromagnetic wave attenuating film characterized by comprising a dielectric base material having a front surface and a back surface, a thin-film conductive layer disposed on the front surface, and a planar inductor or an affixed layer disposed on the back surface, the thin-film conductive layer including a plurality of metal plates, wherein the value of the natural log of a value obtained by normalizing a thickness T of the metal plates with a skin depth d falls within a predetermined numerical range in a specific frequency band. The electromagnetic wave attenuating film of the present invention may be used in a specific frequency band, and may be configured such that the dielectric base material has irregularities on the front surface comprising first regions of relatively low recess portions and relatively high second regions, the thin-film conductive layer including a plurality of metal plates disposed in the first region, wherein the first regions are disposed discretely and the second regions are disposed between a plurality of the first regions. A top coat layer may be provided on the thin-film conductive layer.
Inventors:
AOKI ATSUKO (JP)
KONDO SHINPEI (JP)
KONDO SHINPEI (JP)
Application Number:
PCT/JP2021/041096
Publication Date:
May 27, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/04; B32B15/08; B32B27/18; H01Q17/00
Foreign References:
| JP2007073662A | 2007-03-22 | |||
| JP2005012204A | 2005-01-13 | |||
| JP2001156491A | 2001-06-08 | |||
| CN208029314U | 2018-10-30 | |||
| JPH07193387A | 1995-07-28 | |||
| CN110972459A | 2020-04-07 | |||
| CN206807974U | 2017-12-26 | |||
| CN111755837A | 2020-10-09 |
Other References:
See also references of EP 4250890A4
Attorney, Agent or Firm:
PATENT CORPORATE BODY DAI-ICHI KOKUSAI TOKKYO JIMUSHO (JP)
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