Title:
ELECTROMAGNETIC WAVE ATTENUATION FILM
Document Type and Number:
WIPO Patent Application WO/2024/053504
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain, simply and at low cost, an electromagnetic wave attenuation film that has less shift in absorption peak frequency and less change in frequency characteristics and angle characteristics over time, and that has optical translucency, transparency, or an image-blocking property. Accordingly, the electromagnetic wave absorption film of the present invention comprises: a dielectric base material having a front surface and a back surface; a thin-film conductive layer formed on the front surface of the dielectric base material; and a meshed flat-plate inductor that is disposed on the back surface of the dielectric, and is formed of thin wires of conductive thin-film. The thin-film conductive layer includes a plurality of conductive elements. The thin-film conductive layer is a meshed thin-film conductive layer formed of thin wires of conductive thin-film. The conductive elements may be meshed conductive elements. Further, the conductive elements are periodically disposed, and may satisfy the expression (4), where T is the thickness of the conductive elements, and d is the skin depth. (4): -2 ≤ ln(T/d) ≤ 1
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Inventors:
KOTAKA RYOSUKE (JP)
AOKI ATSUKO (JP)
AOKI ATSUKO (JP)
Application Number:
PCT/JP2023/031414
Publication Date:
March 14, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
H05K9/00; B32B3/24; B32B7/025; B32B15/04; B32B27/18; B32B27/30; H01Q17/00
Domestic Patent References:
| WO2022107637A1 | 2022-05-27 |
Foreign References:
| JP2010003964A | 2010-01-07 | |||
| JP2010118552A | 2010-05-27 |
Attorney, Agent or Firm:
DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)
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