Title:
ELECTROMAGNETIC WAVE INTERFERENCE ABSORBING BODY
Document Type and Number:
WIPO Patent Application WO/2023/176382
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave interference absorbing body that includes: a dielectric layer containing conductive particles and a resin in which the conductive particles are dispersed; and an electromagnetic wave reflection layer. The conductive particles have the shape of a disk, ring, or C-type ring with an average outer diameter of 1,000nm or less and an average thickness that is no more than 5/9 of the average outer diameter.
Inventors:
BOLOTOV SERGEY (JP)
AKAMA HIROSHI (JP)
HIRATA KOJI (JP)
ORIHARA KATSUHISA (JP)
KANEHIRA HIROKI (JP)
AKAMA HIROSHI (JP)
HIRATA KOJI (JP)
ORIHARA KATSUHISA (JP)
KANEHIRA HIROKI (JP)
Application Number:
PCT/JP2023/006890
Publication Date:
September 21, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01Q17/00; H05K9/00
Foreign References:
| JP2022024470A | 2022-02-09 | |||
| JP2004111394A | 2004-04-08 | |||
| JP2001320299A | 2001-11-16 | |||
| JP2012015311A | 2012-01-19 | |||
| JP2001223493A | 2001-08-17 | |||
| JP2001053487A | 2001-02-23 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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