Title:
ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2023/162702
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shield film that does not readily accumulate volatile components between a metal layer and a conductive adhesive layer and has sufficiently high shielding properties for electromagnetic waves in the high-frequency band. This electromagnetic wave shield film is characterized by being formed by layering, in order, a protection layer, an isotropic conductive adhesive layer, a metal layer, and a conductive adhesive layer, the metal layer having an opening part.
Inventors:
SHIBATA YOUHEI (JP)
KAMINO KENJI (JP)
KAMINO KENJI (JP)
Application Number:
PCT/JP2023/004388
Publication Date:
August 31, 2023
Filing Date:
February 09, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/12; B32B15/08; B32B27/18
Foreign References:
| JP7001187B1 | 2022-01-19 | |||
| JP2020194940A | 2020-12-03 | |||
| JP2021090013A | 2021-06-10 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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