Title:
ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2023/190425
Kind Code:
A1
Abstract:
Provided is an electromagnetic shield film in which the interlayer adhesion between an adhesive layer and a shield layer is unlikely to break down even upon heating with reflow etc. An electromagnetic shield film according to the present invention comprises an adhesive layer and a shield layer that is laminated on the adhesive layer, said electromagnetic shield film being characterized in that: the adhesive layer contains resin and porous inorganic particles; and the pore volume of the porous inorganic particles is more than 0.44 mL/g but not more than 1.80 mL/g.
Inventors:
SHIBATA YOUHEI (JP)
Application Number:
PCT/JP2023/012360
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025
Foreign References:
| JP2016204567A | 2016-12-08 | |||
| JP2015053412A | 2015-03-19 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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