Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/210631
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film which is both permeable to volatile components and has shielding characteristics, and which exhibits a sufficiently high bending resistance. This electromagnetic wave shielding film comprises: an adhesive layer; a metal layer comprising a metal and layered on the adhesive layer; and an insulation layer layered on the metal layer. The electromagnetic wave shielding film is characterized in that: a plurality of openings are formed in the metal layer; the openings include island-shaped metal layer formation openings (A) in which at least one island-shaped metal layer is formed on the inside of the opening; and the island-shaped metal layer formation openings (A) include an island-shaped metal layer formation opening (A1) in which the total value of the area of the island-shaped metal layers of one island-shaped metal layer formation opening (A) is 40-80% of the area inside the outline of the one island-shaped metal layer formation opening (A).
Inventors:
KATSUKI TAKAHIKO (JP)
TAJIMA HIROSHI (JP)
YAMAUCHI SIROU (JP)
TAJIMA HIROSHI (JP)
YAMAUCHI SIROU (JP)
Application Number:
PCT/JP2022/015253
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/08; H05K1/02
Domestic Patent References:
WO2016052225A1 | 2016-04-07 |
Foreign References:
JP2008306177A | 2008-12-18 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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