Title:
ELECTROMAGNETIC WAVE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2021/141067
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film that exhibits a low electrical connection resistance value and an excellent transparency even when conductive particles are blended in large amounts into a conductive adhesive layer. The electromagnetic wave shielding film according to the present invention has a first insulating layer, a transparent conductive layer, a second insulating layer, and a conductive adhesive layer laminated in the indicated sequence. The transparent conductive layer is a 5-100 nm-thick metal layer constituted of gold, silver, copper, palladium, nickel, aluminum, or an alloy of the same. The second insulating layer has a thickness of 50-1,000 nm. The conductive adhesive layer contains a binder component and spherical or dendritic conductive particles, wherein the conductive particle content is 1-80 mass% with respect to 100 mass% for the conductive adhesive layer.
Inventors:
UMEMURA SHIGEKAZU (JP)
ISOBE OSAMU (JP)
ISOBE OSAMU (JP)
Application Number:
PCT/JP2021/000263
Publication Date:
July 15, 2021
Filing Date:
January 07, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
B32B15/08; H05K1/02; H05K9/00
Foreign References:
| JPH02271697A | 1990-11-06 | |||
| JP2001185894A | 2001-07-06 | |||
| JP2002246788A | 2002-08-30 | |||
| JP2016107504A | 2016-06-20 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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