Title:
ELECTROMAGNETIC WAVE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2021/172396
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film that can easily exhibit exceptional electrical conductivity between a ground member and a shielding layer when the ground member is positioned on the electromagnetic wave shielding film. An electromagnetic wave shielding film 1 has an electrically conductive adhesive layer 11, a shielding layer 12, and an insulating layer 13 laminated in the stated order. The ratio [electrically conductive adhesive layer/insulating layer] of the Martens hardness based on ISO 14577-1 of the electrically conductive adhesive layer 11 to the Martens hardness based on ISO 14577-1 of the insulating layer 13 is 0.3 or greater.
Inventors:
KATSUKI TAKAHIKO (JP)
TAJIMA HIROSHI (JP)
HARUNA YUUSUKE (JP)
TAJIMA HIROSHI (JP)
HARUNA YUUSUKE (JP)
Application Number:
PCT/JP2021/006983
Publication Date:
September 02, 2021
Filing Date:
February 25, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025; H05K1/02; H05K3/28
Domestic Patent References:
| WO2018147426A1 | 2018-08-16 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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