Title:
ELECTROMAGNETIC WAVE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2021/177328
Kind Code:
A1
Abstract:
Provided is an electromagnetic shielding film that is excellent from an economic standpoint, has outstanding adhesiveness to a printed wiring board, can exhibit excellent shielding capability after passing through a high-temperature environment, and has outstanding connection stability between an electromagnetic shielding layer and a ground circuit. This electromagnetic wave shielding film 1 is provided with an electromagnetic wave shielding layer 2 and a conductive adhesive layer 3 disposed on one side of the electromagnetic wave shielding layer 2; the electromagnetic wave shielding layer 2 includes aluminum as a constituent material; the conductive adhesive layer 3 includes nickel particles as conductive particles; the average roundness of the nickel particles is 0.85 or less; and the 10% cumulative value of the roundness is 0.65 or less.
Inventors:
KAMINO KENJI (JP)
MORIMOTO SYOUHEI (JP)
TAJIMA HIROSHI (JP)
MORIMOTO SYOUHEI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2021/008033
Publication Date:
September 10, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025
Domestic Patent References:
| WO2017164174A1 | 2017-09-28 | |||
| WO2019077909A1 | 2019-04-25 |
Foreign References:
| US20180082971A1 | 2018-03-22 | |||
| JP2015097240A | 2015-05-21 | |||
| JP2003110279A | 2003-04-11 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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