Title:
ELECTROMAGNETIC-WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/138701
Kind Code:
A1
Abstract:
Provided are an electromagnetic-wave shielding material, an electronic component including the electromagnetic-wave shielding material, and an electronic apparatus, the electromagnetic-wave shielding material comprising a multilayer structure including two metal layers sandwiching a high-permeability layer which is an insulating layer having a complex relative permeability with the real part of more than or equal to 30 at a frequency of 100 kHz.
Inventors:
MIKAMI TATSUO (JP)
Application Number:
PCT/JP2021/047506
Publication Date:
June 30, 2022
Filing Date:
December 22, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/04; B32B15/08; B32B27/18; H01F1/26; H01F1/37
Foreign References:
| JPS62256498A | 1987-11-09 | |||
| JP2009081234A | 2009-04-16 | |||
| JPH0779085A | 1995-03-20 | |||
| JP2019503068A | 2019-01-31 | |||
| JP2018131640A | 2018-08-23 | |||
| JP2015187260A | 2015-10-29 | |||
| JP2003020453A | 2003-01-24 |
Other References:
"Lumped constant equivalent circuit of electric field/magnetic field shielding effect measuring instrument (KEC method", TECHNICAL REPORT OF THE INSTITUTE OF IMAGE INFORMATION AND TELEVISION ENGINEER, vol. 25.30, 2001
"Electromagnetic wave shielding technology in a semiconductor package", TOSHIBA REVIEW, vol. 67, no. 2, 2012, pages 8
"Electromagnetic wave shielding technology in a semiconductor package", TOSHIBA REVIEW, vol. 67, no. 2, 2012, pages 8
Attorney, Agent or Firm:
SIKS & CO. (JP)
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