Title:
ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004698
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding material having one or more magnetic layers containing magnetic particles and a resin, wherein the content of the magnetic particles in the magnetic layer is more than 70 parts by mass and not more than 95 parts by mass, with the total mass of the magnetic layer being 100 parts by mass, the resin includes a urethane bond-containing resin and a diene resin, and the magnetic layer further includes a crosslinking agent. Also provided are an electronic component and an electronic device including the electromagnetic wave shielding material.
Inventors:
FUKAGAWA KIYOTAKA (JP)
Application Number:
PCT/JP2023/022342
Publication Date:
January 04, 2024
Filing Date:
June 16, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/08; B32B15/095; C08K3/08; C08K3/22; C08L9/00; C08L75/04; H01F1/26
Foreign References:
| JP2003243877A | 2003-08-29 | |||
| JPH1112376A | 1999-01-19 | |||
| JP2017228598A | 2017-12-28 | |||
| JPH0779085A | 1995-03-20 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF:
Previous Patent: ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC PART, AND ELECTRONIC APPARATUS
Next Patent: BENDING METHOD
Next Patent: BENDING METHOD