ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Title:

ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/004889

Kind Code:

A1

Abstract:

The present invention provides an electromagnetic wave shielding material that has a magnetic layer, which contains magnetic particles and a resin, between two metal layers, wherein: the magnetic layer is in direct contact with the two metal layers; and the magnetic layer contains not less than 13 parts by mass but less than 30 parts by mass of a urethane bond-containing resin if the total mass of the magnetic layer is taken as 100 parts by mass. The present invention also provides: an electronic component which comprises this electromagnetic wave shielding material; and an electronic device.

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Inventors:

FUKAGAWA KIYOTAKA (JP)
MIKAMI TATSUO (JP)

Application Number:

PCT/JP2023/023447

Publication Date:

January 04, 2024

Filing Date:

June 26, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

H05K9/00; B32B7/027; B32B15/08; B32B15/20; B32B27/18; B32B27/40; H01B5/14; H01F1/26

Foreign References:

JP2021028940A

2021-02-25

Attorney, Agent or Firm:

SIKS & CO. (JP)

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