Title:
ELECTROMAGNETIC WAVE SHIELDING MATERIAL HAVING MULTI-LAYER STRUCTURE, AND SEMICONDUCTOR CHIP DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/211098
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic wave shielding material for blocking electromagnetic waves in a high frequency band of 2GHz or higher. The electromagnetic wave shielding material comprises: a first shielding layer formed of a first material having a first conductivity; a second shielding layer stacked on the first shielding layer and formed of a second material having a second conductivity that is lower than the first conductivity; and a third shielding layer, which is stacked on the second shielding layer, is formed of a third material having a third conductivity that is higher than the second conductivity, and has a thickness that is greater than the thickness of the second shielding layer, wherein the thickness of the first shielding layer is greater than or equal to the thickness of the third shielding layer.
Inventors:
SUH SU JEONG (KR)
KWON HYUN JUN (KR)
PARK JONG HWAN (KR)
PARK JUNG HO (KR)
KWON HYUN JUN (KR)
PARK JONG HWAN (KR)
PARK JUNG HO (KR)
Application Number:
PCT/KR2023/005564
Publication Date:
November 02, 2023
Filing Date:
April 24, 2023
Export Citation:
Assignee:
RESEARCH ＆ BUSINESS FOUNDATION SUNGKYUNKWAN UNIV (KR)
International Classes:
H05K9/00; H01L23/552
Foreign References:
| KR20220025875A | 2022-03-03 | |||
| KR20200089113A | 2020-07-24 | |||
| KR20120105485A | 2012-09-25 |
Other References:
WATANABE ATOM O.; RAJ PULUGURTHA MARKONDEYA; WONG DENNY; MULLAPUDI RAVI; TUMMALA RAO: "Multilayered Electromagnetic Interference Shielding Structures for Suppressing Magnetic Field Coupling", JOURNAL OF ELECTRONIC MATERIALS, SPRINGER US, NEW YORK, vol. 47, no. 9, 31 May 2018 (2018-05-31), New York, pages 5243 - 5250, XP036556255, ISSN: 0361-5235, DOI: 10.1007/s11664-018-6387-2
PARK JONG-HWAN; RO JAE CHUL; SUH SU JEONG: "Optimization of the NiFe/Cu multilayer structure using magnetron sputtering for electromagnetic interference shielding in high-frequency bands", JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS, CHAPMAN AND HALL, LONDON., GB, vol. 33, no. 7, 25 January 2022 (2022-01-25), GB , pages 4064 - 4071, XP037703149, ISSN: 0957-4522, DOI: 10.1007/s10854-021-07599-3
PARK JONG-HWAN; RO JAE CHUL; SUH SU JEONG: "Optimization of the NiFe/Cu multilayer structure using magnetron sputtering for electromagnetic interference shielding in high-frequency bands", JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS, CHAPMAN AND HALL, LONDON., GB, vol. 33, no. 7, 25 January 2022 (2022-01-25), GB , pages 4064 - 4071, XP037703149, ISSN: 0957-4522, DOI: 10.1007/s10854-021-07599-3
Attorney, Agent or Firm:
PARK, Sang Youl (KR)
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