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Title:
ELECTRON BEAM-CURABLE COMPOSITION, AND FOOD PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/180887
Kind Code:
A1
Abstract:
This electron beam-curable composition contains (A) a (meth)acrylate component that contains one or more (meth)acrylate compounds (excluding silicone-modified compounds). The (meth)acrylate component (A) contains a (meth)acrylate compound (A-1) having a molecular weight of 500 or more. The content of the (meth)acrylate compound (A-1) is 70 mass% or more of the total mass of the composition. The content of (meth)acrylate compounds having molecular weights of less than 500 in the (meth)acrylate component (A) is less than 25 mass% of the total mass of the composition.

Inventors:
TAKEDA MASASHI (JP)
Application Number:
PCT/JP2021/029434
Publication Date:
September 01, 2022
Filing Date:
August 06, 2021
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYO INK CO LTD (JP)
International Classes:
C08F2/44; C09D11/101; C09D11/102
Domestic Patent References:
WO2019235206A12019-12-12
WO2015133542A12015-09-11
WO2015148094A12015-10-01
WO2020012157A12020-01-16
WO2020012160A12020-01-16
Foreign References:
JP2012072214A2012-04-12
JP2009067013A2009-04-02
JP2007331128A2007-12-27
JP2007217452A2007-08-30
JP2020105307A2020-07-09
JP2005154748A2005-06-16
JP2007204543A2007-08-16
JP2009221441A2009-10-01
JP2020147730A2020-09-17
JP2019509196A2019-04-04
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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