ELECTRONIC APPARATUS CASE

WIPO Patent Application WO/2023/162527

A1

[Problem] To provide a technology by which an electronic apparatus case can be made lighter while ensuring electromagnetic compatibility and heat dissipation properties thereof. [Solution] This electronic apparatus case is provided with a support section, an interior space, and a wall section. The support section is formed from a metal and has a support surface. The interior space is located above the support surface and accommodates the electronic apparatus. The wall section is formed from a material having a resin as the primary component thereof, said material having been configured so as to suppress the transmission of electromagnetic waves, is joined to the support section, and has an inner peripheral surface surrounding the interior space above the support surface. The transmission attenuation S21 of the wall section at 77 GHz may be 10 dB or greater. In this electronic apparatus case, a weight reduction can be achieved due to configuring the wall section from the material that has a resin as the primary component thereof, while a heat dissipation property is also ensured due to configuring the support section from a metal. Additionally, in this electronic apparatus case, an electromagnetic compatibility property can be ensured, even though the wall section is configured from the material that has a resin as the primary component thereof, due to configuring the material that makes up the wall section so as to suppress the transmission of electromagnetic waves.

ZHANG XUELEI (JP)
KAWAGUCHI HISASHI (JP)

PCT/JP2023/001502

August 31, 2023

January 19, 2023

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KK RIKEN (JP)

H05K9/00; H01L23/00; H01Q17/00; H05K7/20

JP2011189868A	2011-09-29
JP2020080643A	2020-05-28
JP2010267927A	2010-11-25

MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)

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