Title:
ELECTRONIC APPARATUS COMPRISING CONNECTOR OF STACKED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/151797
Kind Code:
A1
Abstract:
Disclosed is an electronic apparatus, according to one embodiment of the present invention, comprising: a first printed circuit board which comprises at least one electronic component; a first header which is mounted on the first printed circuit board; a first module which comprises a first socket for being coupled to the first header on a first surface and a second header on a second surface facing the first surface in order to perform a first function; a second module which comprises a second socket for being coupled to the second header on one surface thereof in order to perform a second function; and a processor which is electrically connected to the first header, wherein the processor is configured to convey, to the first header, at least one first signal for controlling the first module or at least one second signal for controlling the second module. In addition, it could be understood from the specification that other various embodiments are possible.
Inventors:
PARK JUNGHOON (KR)
KIM YONGHWA (KR)
LEE HYANGBOK (KR)
SON DONGIL (KR)
KIM YONGHWA (KR)
LEE HYANGBOK (KR)
SON DONGIL (KR)
Application Number:
PCT/KR2019/001349
Publication Date:
August 08, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04M1/02
Foreign References:
| KR20120067654A | 2012-06-26 | |||
| KR101231041B1 | 2013-02-07 | |||
| JP2007227180A | 2007-09-06 | |||
| JP2017010921A | 2017-01-12 | |||
| KR20160090549A | 2016-08-01 |
Other References:
See also references of EP 3726821A4
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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