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Patent Searching and Data


Title:
ELECTRONIC APPARATUS INCLUDING MICROPHONE MODULE
Document Type and Number:
WIPO Patent Application WO/2022/154470
Kind Code:
A1
Abstract:
An electronic apparatus according to an embodiment may comprise: a housing; a printed circuit board located inside the housing; a microphone substrate which is electrically connected to the printed circuit board and on which a microphone element and a flash element are arranged; a decoration member disposed facing the microphone substrate in a first direction and forming a portion of the surface of the housing, the decoration member having a second opening that is aligned with the flash element; and a flash window facing the decoration member, the flash window including a first portion that is accommodated in the second opening and aligned with the flash element in the first direction, and a second portion that extends from the first portion and passes between the decoration member and the microphone substrate. The electronic apparatus provides an audio input path for the microphone element, and the audio input path may include a gap formed between the first portion and the inner wall of the second opening.

Inventors:
SHIM MINCHANG (KR)
MOON HEECHEUL (KR)
SON KWONHO (KR)
LEE YONGSEOK (KR)
KIM SANGMIN (KR)
NOH DAEYOUNG (KR)
SEOK SANGYOUP (KR)
JUNG YANGGYUN (KR)
Application Number:
PCT/KR2022/000549
Publication Date:
July 21, 2022
Filing Date:
January 12, 2022
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/16; H04R1/20
Foreign References:
US20200266845A12020-08-20
KR20190028284A2019-03-18
JP2020531947A2020-11-05
KR20160042054A2016-04-18
CN104821972A2015-08-05
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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