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Title:
ELECTRONIC APPARATUS, METHOD FOR MANUFACTURING SAME, LIGHT-EMITTING APPARATUS, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/233985
Kind Code:
A1
Abstract:
The present invention provides an electronic apparatus that has excellent ease of production while achieving size reduction. This electronic apparatus has an insulating film substrate, a thin film device, and a through via. The insulating film substrate includes a first principal surface and a second principal surface on the reverse side from the first principal surface. The thin film device includes a metal layer formed on the first principal surface of the insulating film substrate. The through via penetrates the insulating film substrate from a first portion of the metal layer and extends at least to the second principal surface.

Inventors:
AKASAKA SHIN (JP)
Application Number:
PCT/JP2023/018081
Publication Date:
December 07, 2023
Filing Date:
May 15, 2023
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
G09F9/00; G09F9/30; G09F9/33; H04N5/66; H05B33/02; H05B33/10; H10K50/10; H10K59/00
Foreign References:
JP2016538586A2016-12-08
JP2020057015A2020-04-09
US20210057401A12021-02-25
JP2005086075A2005-03-31
JP2022515486A2022-02-18
JP2013025307A2013-02-04
JP2020012972A2020-01-23
JP2002162626A2002-06-07
JP2010232577A2010-10-14
JP2015197544A2015-11-09
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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