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Title:
ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/172024
Kind Code:
A1
Abstract:
Provided is a hermetically closable electronic apparatus without hindering size reduction. An electronic apparatus (1) relating to the present invention is provided with a housing (60), and a panel (10) held in the housing (60), and the panel (10) includes a first bonding region that is bonded to the housing (60) by means of a first bonding member (70a), which is an adhesive.

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Inventors:
SATO TAKAFUMI (JP)
Application Number:
PCT/JP2013/003089
Publication Date:
November 21, 2013
Filing Date:
May 15, 2013
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H04M1/02; H04M1/03; H04R1/00; H04R1/02; H04R7/04; H04R17/00
Foreign References:
JP2006333021A2006-12-07
JP2005348193A2005-12-15
JPH0973072A1997-03-18
JP2007180827A2007-07-12
JP2009246819A2009-10-22
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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