BACKGROUND

[0001 ] An electronic assembly, such as an electronically controlled display system is employed in a vehicle to function as an infotainment system for rendering content. The electronic assembly may provide information related to the vehicle, such as vehicle data or information related to the vehicle’s surroundings, such as navigation information. Further, the electronic assembly may also act as means for providing entertainment to a rider of the vehicle, such as rendering audio-visual information on a display unit of the electronic assembly. Therefore, the electronic assembly aims for a riding experience that is safe, useful and fun all at the same time.

BRIEF DESCRIPTION OF DRAWINGS

[0002] The detailed description is provided with reference to the accompanying figures. It should be noted that the description and the figures are merely examples of the present subject matter and are not meant to represent the subject matter itself.

[0003] FIG. 1 illustrates an assembled view of the electronic assembly, according to an example of the present subject matter

[0004] FIG. 2A illustrates a first sectional view of the electronic assembly in an assembled condition, according to an example of the present subject matter; [0005] FIG. 2B illustrates a second sectional view of the electronic assembly in an assembled condition, according to an example of the present subject matter;

[0006] FIG. 3A illustrates a first exploded view of the electronic assembly, according to an example of the present subject matter;

[0007] FIG. 3B illustrates a second exploded view of the electronic assembly, according to an example of the present subject matter;

[0008] FIG. 4A illustrates an isometric view of the circuit board, according to an example of the present subject matter;

[0009] FIG. 4B illustrates a top view of the circuit board, according to an example of the present subject matter;

[0010] FIG. 4G illustrates a bottom view of the circuit board, according to an example of the present subject matter;

[0011] FIG. 4D illustrates an isometric top view of the circuit board, according to an example of the present subject matter;

[0012] FIG. 4E illustrates an isometric bottom view of the circuit board, according to an example of the present subject matter;

[0013] FIG. 5A illustrates a top view of a holding plate, according to an example of the present subject matter;

[0014] FIG. 5B illustrates a bottom view of the holding plate, according to an example of the present subject matter;

[0015] FIG. 5C illustrates an isometric top view of the holding plate, according to an example of the present subject matter; [0016] FIG. 5D illustrates an isometric bottom view of the holding plate, according to an example of the present subject matter;

[0017] FIG. 6A illustrates a top view of the electronic component, the circuit board and the holding plate, according to an example of the present subject matter;

[0018] FIG. 6B illustrates a bottom view of the electronic component, the circuit board and the holding plate, according to an example of the present subject matter;

[0019] FIG. 7 illustrates a perspective view of the heat sink couped to the circuit board, according to an example of the present subject matter;

[0020] FIG. 8 illustrates a top view of the heat sink, according to an aspect of the present subject matter;

[0021] FIG. 9A illustrates a top view of the heat sink, according to another aspect of the present subject matter;

[0022] FIG. 9B illustrates a bottom view of the heat sink, according to another aspect of the present subject matter;

[0023] FIG. 10A illustrates a perspective view of an end plate of the heat sink, according to another aspect of the present subject matter.

[0024] FIG. 10B illustrates a bottom view of the end plate of the heat sink, according to another aspect of the present subject matter; [0025] FIG. 10C illustrates an isometric top view of the end plate of the heat sink, according to another aspect of the present subject matter;

[0026] FIG. 10D illustrates an isometric bottom view of the end plate of the heat sink, according to another aspect of the present subject matter;

[0027] FIG. 11 A illustrates a top view of a back cover of the heat sink, according to another aspect of the present subject matter;

[0028] FIG. 11 B illustrates a bottom view of the back cover of the heat sink, according to another aspect of the present subject matter;

[0029] FIG. 11 C illustrates an isometric top view of the back cover of the heat sink, according to another aspect of the present subject matter; and

[0030] FIG. 1 1 D illustrates an isometric bottom view of the back cover of the heat sink, according to another aspect of the present subject matter.

[0031] Throughout the drawings, identical reference numbers designate similar elements, but may not designate identical elements. The figures are not necessarily to scale, and the size of certain parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings. DETAILED DESCRIPTION

[0032] An electronic assembly includes different electronic components, such as a processing unit, an inductor, a transistor, a capacitor, a control unit, a plurality of wires, etc. The electronic assembly further includes a circuit board on which the different electronic components are mounted. Further, the circuit board is operably coupled to an electronic component, such as a display unit (for example, a TFT display). The control unit receives data from a plurality of sub-systems, such as a plurality of sensors. Further, the control unit transmits the received data to the processing unit which processes the data and further transmits the processed data to the electronic component.

[0033] Since, the processing unit is required to process a large amount of data received from the control unit, the processing unit generates unintentional heat while in operation. The generated heat may affect the performance of the processing unit, for instance the efficiency of the processing unit to process the data received from the control unit might reduce significantly. As a result, the performance of the electronic assembly may get affected. In an extreme condition, the heat generated by the processing unit may cause a permanent damage to the processing unit. Further, the heat generated by the processing unit may also affect the performance of the other electronic components mounted on the circuit board. Further, the operating conditions of a system, onto which the electronic assembly is employed, may also result in overheating the processing unit. For instance, in case the electronic assembly is used in a vehicle, the processing unit may get overheated if the vehicle is being operated continuously for a long time or in a case where the vehicle is exposed to direct sun light, or due to internal operating condition of signal generation, etc. Therefore, it is necessary to dissipate the heat generated by the processing unit of the electronic assembly to bring down the temperature to a safe operating temperature.

[0034] The present subject matter seeks to address the problems elucidated above. The present subject matter relates to an electronic assembly having a structure that facilitates in enhancing the heat transfer between a heat generating portion of the electronic assembly and a heat sink. In addition, according to the present subject matter, the electronic assembly is designed such that various non-heat generating circuit elements are not affected by the heat generated from the heat generating portion, thereby ensuring a smooth operation of the electronic assembly.

[0035] The electronic assembly may be an electronically controlled display system used in a vehicle to function as an infotainment system for rendering content. According to an aspect, the electronic assembly includes an electronic component, a circuit board and a heat sink. The circuit board is operably coupled to the electronic component. Further, the circuit board includes a heat generating portion having at least one circuit element. In an example, the circuit element may be a processor. During the operation of the electronic assembly, the circuit element generates heat. In other words, one or more heat generating circuit elements are mounted on the heat generating portion of the circuit board. Further, the heat sink is thermally coupled to the circuit board such that heat transfer between the heat sink and the circuit board is possible. The heat sink includes a heat collecting region and a heat dissipating region opposite to the heat collecting region. The heat collecting region is coupled to the heat generating portion of the circuit board for heat exchange therefrom. Further, the electronic assembly is designed such that a size of the heat collecting region of the heat sink is at least 35% to 45% of a size of the heat generating portion of the circuit board. In an example, the size of the heat collecting region of the heat sink may be substantially equal to the size of the heat generating portion of the circuit board. In other words, the size of the heat collecting region of the heat sink is at most about 100% of the size of the heat generating portion of the circuit board.

[0036] According to the present subject matter, since the heat generating region of the heat sink is coupled to the heat generating portion of the circuit board, heat transfer can take place between the heat sink and the heat generating portion of the circuit board. Accordingly, temperature of the electronic assembly can be brought down to a safe operating temperature. Further, the circuit board comprises a plurality of non-heat generating circuit elements mounted on a surface opposite to a surface bearing the at least one circuit element generating heat during operation. In other words, the circuit board is designed such that the heat generating circuit elements are mounted on one side of the circuit board and non-heat generating circuit elements are mounted on another side of the circuit board. As a result, the non-heat generating circuit elements of the circuit board are isolated form the heat generating circuit elements of the circuit board. Therefore, the non-heat generating circuit elements mounted on the circuit board are not affected by the heat generating circuit elements, and therefore the non-heat generating circuit elements can perform their operations smoothly.

[0037] Further, to ensure that an effective transfer of heat takes place between the heat sink and the heat generating portion of the circuit board, minimum size of the heat collecting region of the heat sink may at least be 35% to 45% of size of the heat generating portion of the circuit board. Therefore, the heat sink may be made of a smaller size, and accordingly the electronic assembly may have a compact size. In an example, in case a higher rate of heat transfer is required between the heat sink and the circuit board, a bigger size of heat sink may be used. For instance, the size of the heat collecting region of the heat sink may be at most about 100% of the size of the heat generating portion of the circuit board.

[0038] According to an aspect, the heat sink can be formed as a back cover made of a heat conducting material. In an example, the back cover may be made of an Aluminium alloy or a Copper alloy. In said aspect, the back cover or the heat sink may entirely be made of the heat conducting material. In said example, since, the heat sink is made of the heat conducting material, an enhanced rate of heat transfer may be possible between the heat sink and the circuit board. According to another example, the back cover in said aspect may be manufactured by a casting process. In said example, the back cover may include an elevated portion having the heat collecting region of the heat sink. In an assembled condition of the electronic assembly, the elevated portion may be in direct contact with the heat generating portion of the circuit board.

[0039] According to another aspect, the heat sink may include a back cover made of a non-conductive material and an end plate made of a heat conductive material. For instance, the back cover may be formed of plastic and the end plate may be formed of Aluminium alloy or Copper alloy. The end plate includes the heat collecting region and the heat dissipating region. Further, the heat collecting region may be formed as a protrusion or an elevated portion on the heat dissipating region. The back cover may include a cavity into which the heat dissipating region of the end plate is disposed. In the assembled position of the electronic assembly, the back cover may abut the end plate. In an example, the end plate may be insert moulded with the back cover to be integrated therewith. Given that only a portion of the heat sink, according to the said aspect, is made of the heat conducting material, the weight and cost of the electronic assembly may be significantly reduced.

[0040] According to an example, the heat sink may include a plurality of fins formed on a surface opposite to the heat dissipating region of the heat sink. In an example the fins may be formed on the heat dissipating region of the heat sink. The fins facilitate a higher rate of heat dissipation from the heat sink. As a result, the circuit board can be cooled down to the desired operating temperature rapidly. Further, according to an example of the present subject matter, a thermal adhesive, such as a thermal tape or a thermal grease, may be disposed between the heat collecting region of the heat sink and the heat generating portion of the circuit board. The thermal adhesive may help in improving the rate of heat transfer between the heat generating portion of the circuit board and the heat collecting region of the heat sink. Further, the thermal adhesive may also facilitate in sealing any gap formed between the heat generating portion of the circuit board and the heat collecting region of the heat sink. Furthermore, the thermal adhesive may also reduce the thermal stress that may be formed in the heat generating portion of the circuit board due to high temperatures.

[0041 ] The electronic assembly may further include a holding plate for providing support to the electronic component, the circuit board, and the heat sink. The circuit board may be sandwiched between the heat sink and the holding plate. Further, the holding plate is positively coupled to the heat sink to maintain contact between the heat collecting region of the heat sink and the heat generating portion of the circuit board. In other words, the holding plate is mechanically coupled with the heat sink, such that a positive pressure is created which may result in a better thermal contact between the heat sink and the circuit board, and therefore, an enhanced heat transfer between the heat collecting region of the heat sink and the heat generating portion of the circuit board is possible.

[0042] According to an aspect, the electronic assembly may further include a flat cable having one or more electronic elements mounted thereon. The flat cable may be adapted to connect the electronic component and the circuit board supported on by the holding plate. In one example, the holding plate includes a recess and a slot. The recess may be adapted to accommodate the one or more electronic elements while, the slot may allow the flat cable to be routed via the holding plate for connecting the electronic component and the circuit board. In an example, the holding plate may include a first cavity facing the circuit board to at least accommodate the circuit elements and the non-heat generating circuit elements mounted on to the circuit board. Further, the holding plate may include a second cavity formed opposite to the first cavity. The second cavity may be adapted to accommodate one or more components mounted on the electronic component.

[0043] The present subject matter is further described with reference to the accompanying figures. Wherever possible, the same reference numerals are used in the figures and the following description to refer to the same or similar parts. It should be noted that the description and figures merely illustrate principles of the present subject matter. It is thus understood that various arrangements may be devised that, although not explicitly described or shown herein, encompass the principles of the present subject matter. Moreover, all statements herein reciting principles, aspects, and examples of the present subject matter, as well as specific examples thereof, are intended to encompass equivalents thereof.

[0044] FIG. 1 illustrates an assembled view of the electronic assembly 100, according to an example of the present subject matter. FIG. 2A illustrates a first sectional view of the electronic assembly 100 in an assembled condition, according to an example of the present subject matter. FIG. 2B illustrates a second sectional view of the electronic assembly 100 in an assembled condition, according to an example of the present subject matter. FIG. 3A illustrates a first exploded view of the electronic assembly 100, according to an example of the present subject matter. FIG. 3B illustrates a second exploded view of the electronic assembly 100, according to an example of the present subject matter. For the sake of brevity and ease of understanding, FIGS. 1 , 2A-2B and 3A- 3B have been discussed in conjunction with each other.

[0045] The electronic assembly 100 may be an electronically controlled display system that may be used in a vehicle to function as an infotainment system for rendering content. In an example, the electronic assembly 100 may be a display system with concentrated heat zones for any automobile or similar applications. The electronic assembly 100 includes an electronic component 102, a circuit board 104 and a heat sink 106. In an example, the electronic component 102 may be a thin film transistor (TFT) display. The circuit board 104 may operably be coupled to the electronic component 102. Further, the heat sink 106 may thermally be coupled to the circuit board 104 such that heat transfer between the heat sink 106 and the circuit board 104 is possible.

[0046] FIG. 4A illustrates an isometric view of the circuit board 104, according to an example of the present subject matter. FIG. 4B illustrates a top view of the circuit board 104, according to an example of the present subject matter. FIG. 4G illustrates a bottom view of the circuit board 104, according to an example of the present subject matter. FIG. 4D illustrates an isometric top view of the circuit board 104, according to an example of the present subject matter. FIG. 4E illustrates an isometric bottom view of the circuit board 104, according to an example of the present subject matter. For the sake of brevity and ease of understanding, FIGS. 4A-4E have been discussed in conjunction with each other.

[0047] The circuit board 104 includes a heat generating portion 108 and a non-heat generating portion 110. In an example, the circuit board 104 may be a printed circuit board (PCB). The circuit board 104 may have various components mounted on its body. The components of the circuit board 104 include at least one circuit element 112 that can generate heat during operation of the electronic assembly 100 and the at least one circuit element 112 is mounted on the heat generating portion 108 of the circuit board 104. In other words, the heat generating portion 108 of the circuit board 104 is referred to as so, owing to the mounting of heat generating component, such as the circuit element 112, that may generate heat during its operation and may adversely affect the performance of the electronic assembly 100. In an example, the circuit element 1 12 may be a processor.

[0048] Further, the components of the circuit board 104 include a plurality of non-heat generating circuit elements 114 mounted on the non- heat generating portion 1 10 of the circuit board 104. The non-heat generating circuit elements 114 generate no or negligible heat when the electronic assembly 100 is in operation. Similar to as explained above, the non-heat generating portion 110 of the circuit board 104 is referred to as so, owing to the mounting of non-heat generating component, such as the non-heat generating circuit elements 114, In one example, the non- heat generating circuit elements 114 may include a MOSFET, an inductor, a capacitor, etc.

[0049] In order to protect the non-heat generating circuit elements 114 from the heat generated during operation of the electronic assembly 100, the circuit element 1 12 and the non-heat generating circuit elements 114 are mounted on the circuit board 104 opposite to one another. In other words, the non-heat generating circuit elements 114 are mounted on a surface opposite to a surface bearing the circuit element 112 that may generate heat during operation. Therefore, the circuit board 104 is designed such that the circuit elements 112 are mounted on one side of the circuit board 104 and non-heat generating circuit elements 114 are mounted on another side of the circuit board 104. As a result, the non- heat generating circuit elements 114 of the circuit board 104 are isolated form the circuit elements 112 of the circuit board 104. Therefore, the non- heat generating circuit elements 114 mounted on the circuit board are not affected by the circuit elements 112, and as a result, the non-heat generating circuit elements 114 can perform their operations smoothly.

[0050] The circuit board 104 may include a cut-out 116 provided on its body. The electronic component 102 may include a flat cable 118 which may be inserted through the cut-out 116 provided on the circuit board 104. The flat cable 118 may include one or more electronic elements. The flat cable 118 connects the electronic component 102 to the circuit board 104. The circuit board 104 may further include a connector 120 mounted on the body of the circuit board 104. The flat cable 118 is to be electrically coupled with the connector 120 to operably couple the electronic component 102 to the circuit board 104. Further, the circuit board 104 may include a plurality of indicators 122 mounted in proximity of the periphery of the circuit board 104. In an example, the indicators 122 may be adapted to provide a warning or indication about a malfunction of the electronic assembly 100 or any other element.

[0051] FIG. 5A illustrates a top view of a holding plate 124, according to an example of the present subject matter. FIG. 5B illustrates a bottom view of the holding plate 124, according to an example of the present subject matter. FIG. 5C illustrates an isometric top view of the holding plate 124, according to an example of the present subject matter. FIG. 5D illustrates an isometric bottom view of the holding plate 124, according to an example of the present subject matter. For the sake of brevity and ease of understanding, FIGS. 5A-5D have been discussed in conjunction with each other.

[0052] The electronic assembly 100 further includes the holding plate 124. The holding plate 124 is configured to provide support to the electronic component 102, the circuit board 104, and the heat sink 106. The circuit board 104 (not shown in Fig. 5A-5D) may be sandwiched between the holding plate 124 and the heat sink 106. The holding plate 124 may be coupled to the heat sink 106, such that a positive pressure or force may be generated between the circuit board 104 and the heat sink 106. As a result, a heat collecting region 126 (not shown in Fig. 5A- 5D) of the heat sink 106 (not shown in Fig. 5A-5D) is in a close contact with the heat generating portion 108 (not shown in Fig. 5A-5D) of the circuit board 104. In other words, the holding plate 124 may be mechanically coupled with the heat sink 106 such that a positive pressure may be created, which may result in a better thermal contact between the heat sink 106 and the circuit board 104. As a result, an enhanced heat transfer between the heat collecting region 126 of the heat sink 106 and the heat generating portion 108 of the circuit board 104 is possible. In an example, the holding plate 124 is coupled to the heat sink 106 using a screw or via a snap fitting fastener (not shown).

[0053] In an example, a portion of the holding plate 124 may be removed or cut out to reduce weight of the holding plate 124. As a result, overall weight as well as cost of the electronic assembly 100 can be reduced. Further, a plurality of ribs 130 may be formed in the cut out to provide strength to the holding plate 124. The ribs 130 may provide compensation for reduced strength due to removal of a portion of the holding plate 124.

[0054] In one example, the holding plate 124 may include a locator pillar 156 for the circuit board 104. The locator pillar 156 (shown in Fig. 3B) may facilitate in locating and mounting of the circuit board 104 while assembling the electronic assembly 100 without the use of fasteners having multiple elements, such as a nut and screw assembly, thereby facilitating ease of assembly. Accordingly, the circuit board 104 can be mounted to the holding plate 124 without using fasteners having multiple elements. In an example, the circuit board 104 may be mounted to the holding plate 124 by using a snap fit mechanism. Therefore, the electronic assembly 100 employs a smaller number of mechanical components required to hold the holding plate 124 and the circuit board 104 firmly, thereby reducing the overall weight, cost, and complexity in design of the electronic assembly 100.

[0055] FIG. 6A illustrates a top view of the electronic component 102, the circuit board 104 and the holding plate 124, according to an example of the present subject matter. FIG. 6B illustrates a bottom view of the electronic component 102, the circuit board 104 and the holding plate 124, according to an example of the present subject matter. For the sake of brevity and ease of understanding, FIGS. 6A-6B have been discussed in conjunction with each other.

[0056] The holding plate 124 includes a body portion 132 and a wall 134 formed at the periphery of the body portion 132. The wall 134 protrudes in an axial direction from the surface of the body portion 132. In an example, the axial direction may be understood as being along a central longitudinal axis passing through the body portion 132 and being substantially perpendicular thereto. The holding plate 124 further includes a recess 162 and a slot 136. The recess 162 is defined by the plurality of ribs. The recess 162 may be adapted to accommodate the one or more electronic elements of the flat cable 118. Further, the recess 162 is formed such that it may be opposite to the electronic component 102 in the assembled state. In other words, the recess 162 is so formed on the holding plate 124 such that the recess 162 faces the electronic component 102 when the electronic assembly 100 may be in an assembled condition. Further, the slot 136 formed on the holding plate 124 allows the flat cable 118 to be routed via the holding plate 124 for connecting the electronic component 102 and the circuit board 104.

[0057] Further, the walls 134 of the holding plate 124 may extend from the body portion 132 in the axial direction on either side of the body portion 132 to form two cavities on either side of the body portion 132. Accordingly, the holding plate 124 includes a first cavity 164 and a second cavity 166 opposite to the first cavity 164. The first cavity 164 and the second cavity 166 may be defined by the protruding walls 134 of the holding plate 124. In other words, the first cavity 164 and the second cavity 166 may be formed by the body portion 132 and the walls 134. In particular, the first cavity 164 may be defined by the body portion 132 and the walls 134 protruding from the body portion 132 in an axial direction towards the circuit board 104. In other words, the first cavity 164 faces the circuit board 104, when the electronic assembly 100 may be in an assembled condition. The first cavity 164 may be adapted to accommodate one or more components, such as the circuit element 1 12 and the non-heat generating circuit elements 114 mounted on the circuit board 104 which protrude from the surface of the circuit board 104. Further, the second cavity 166 may be defined by the body portion 132 and the walls 134 protruding from the body portion 132 in an axial direction towards the electronic component 102. In other words, the second cavity 166 faces the electronic component 102, when the electronic assembly 100 is in an assembled condition. The second cavity 166 may be adapted to accommodate one or more components mounted on the electronic component 102.

[0058] Further, the holding plate 124 may include a plurality of housing 168 to accommodate the indicators 122 mounted on the circuit board 104. The indicators 122 protrude from the surface of the circuit board 104. The housing 168 may protrude from the body portion 132 of the holding plate 124. When the circuit board 104 is accommodated into the holding plate 124, the indicators 122 may be housed inside the housing 168. Since the indicators 122 are present on two opposite sides of the circuit board 104, the housing 168 locks with the indicators 122, when the circuit board 104 is accommodated into the holding plate 124. Accordingly, the circuit board 104 may be securely held by the holding plate 124 without requiring a number of mechanical components to hold the holding plate 124 and the circuit board 104 firmly. Therefore, overall weight, cost, and complexity in design of the electronic assembly 100 may be significantly reduced.

[0059] The flat cable 118 is routed through the slot 136 provided in the holding plate 124 and the cut-out 116 proved in the circuit board 104. Further, the flat cable 118 may be bent and then attached to the connector 120 mounted on the circuit board 104. In an example, the holding plate 124 includes an antenna mounting portion 138 for supporting an antenna (not shown) of the electronic assembly 100. The electronic assembly 100 may include a device connector 158. The device connector 158 may be mounted on the circuit board 104. The device connector 158 may be configured to connect the electronic assembly 100 to a device, such as a vehicle, onto which the electronic assembly is employed. Further, the electronic assembly 100 may include a mounting structure 160. The electronic assembly 100 may be mounted to the device by means of the mounting structure 160.

[0060] Further, a flat component 140 may be attached to the holding plate 124, such that the electronic component 102 may be sandwiched between the holding plate 124 and the flat component 140. The flat component 140 may have a cavity at the centre, such that the information provided by the electronic component 102 is not restricted or hindered, for example, in a case where the electronic component 102 is a TFT display. Further, the electronic assembly 100 may include a front cover 142 and a transparent screen 144. The front cover 142 and the transparent screen 144 may be moulded together. Further, the front cover 142 along with the transparent screen 144 may be coupled to the holding plate 124. In an example, a welding process, such as ultrasonic welding, may be used to couple the holding plate 124 with the front cover 142 and the transparent screen 144.

[0061] FIG. 7 illustrates a perspective view of the heat sink 106 couped to the circuit board 104, according to an aspect of the present subject matter. The heat sink 106 includes the heat collecting region 126 and the heat dissipating region 128 opposite to the heat collecting region 126. The heat collecting region 126 may be coupled to the heat generating portion 108 of the circuit board 104 for heat exchange therefrom. Further, the electronic assembly 100 may be designed such that a size of the heat collecting region 126 of the heat sink 106 may at least be 35% to 45% of a size of the heat generating portion 108 of the circuit board 104. In an example, the size of the heat collecting region 126 of the heat sink 106 may be substantially equal to the size of the heat generating portion 108 of the circuit board 104. In other words, the size of the heat collecting region 126 of the heat sink 106 may at most be about 100% of the size of the heat generating portion 108 of the circuit board 104.

[0062] FIG. 8 illustrates a top view of the heat sink 106, according to an aspect of the present subject matter. According to said aspect of the present subject matter, the heat sink 106 may be formed as a single component. The heat sink 106 may be formed as a back cover, entirely made of a heat conducting material. For example, the heat conducting material may be an Aluminium alloy or a Copper alloy. [0063] In said aspect, since the heat sink 106 is entirely made of the heat conducting material, an enhanced rate of heat transfer may be possible between the heat sink 106 and the circuit board 104. According to an example, the heat sink 106, in said aspect, may be manufactured by casting process. In said example, the heat sink 106 may include an elevated portion or a protrusion 146 having the heat collecting region 126 of the heat sink 106. In an assembled condition of the electronic assembly 100, the protrusion 146 may be in direct contact with the heat generating portion 108 of the circuit board 104.

[0064] FIG. 9A illustrates a top view of the heat sink 106, according to another aspect of the present subject matter. FIG. 9B illustrates a bottom view of the heat sink 106, according to another aspect of the present subject matter FIG. 10A illustrates a perspective view of an end plate 150 of the heat sink 106, according to another aspect of the present subject matter. FIG. 10B illustrates a bottom view of the end plate 150 of the heat sink 106, according to another aspect of the present subject matter. FIG. 10C illustrates an isometric top view of the end plate 150 of the heat sink 106, according to another aspect of the present subject matter. FIG. 10D illustrates an isometric bottom view of the end plate 150 of the heat sink 106, according to another aspect of the present subject matter. FIG. 11 A illustrates a top view of a back cover 148 of the heat sink 106, according to another aspect of the present subject matter. FIG. 11 B illustrates a bottom view of the back cover 148 of the heat sink 106, according to another aspect of the present subject matter. FIG. 11 C illustrates an isometric top view of the back cover 148 of the heat sink 106, according to another aspect of the present subject matter. FIG. 11 D illustrates an isometric bottom view of the back cover 148 of the heat sink 106, according to another aspect of the present subject matter. For the sake of brevity and ease of understanding, FIGS. 8A-8B, 9A-9D and 10A- 10D have been discussed in conjunction with each other.

[0065] According to said aspect, the heat sink 106 includes a back cover 148 that may be made of a non-conductive material and an end plate 150 that may be made of a heat conductive material. For instance, the back cover 148 may be formed of plastic and the end plate 150 may be formed of Aluminium alloy or Copper alloy. The end plate 150 includes the heat collecting region 126 and the heat dissipating region 128. Further, the heat collecting region 126 may be formed as a protrusion 146 or an elevated portion on the heat dissipating region 128. The back cover 148 includes a cavity 152 into which the heat dissipating region 128 of the end plate 150 may be disposed. In the assembled position of the electronic assembly 100, the back cover 148 abuts the end plate 150. In an example, the end plate 150 may be insert moulded with the back cover 148 to be integrated therewith. Since only a portion of the heat sink 106, according to the said aspect, is made of the heat conducting material, the weight and cost of the electronic assembly 100 may be significantly reduced.

[0066] In an example, the heat sink 106 may include a plurality of fins 154 formed on a surface opposite to the heat collecting region 126 of the heat sink 106. In other words, the fins 154 may be formed on the heat dissipating region 128 of the heat sink 106. The fins 154 may facilitate in a higher rate of heat dissipation from the heat sink 106. As a result, the circuit board 104 may be cooled down to the desired operating temperature rapidly. In an example, the fins 154 may be made from an Aluminium alloy, such as Aluminium alloy 6063, Aluminium alloy 7068, and the like. [0067] In an example, a thermal adhesive (not shown) may be disposed between the heat collecting region 126 of the heat sink 106 and the heat generating portion 108 of the circuit board 104. an example, the thermal adhesive may be a thermal tape, a thermal grease, etc. The thermal adhesive may help in improving the rate of heat transfer between the heat generating portion 108 of the circuit board 104 and the heat collecting region 126 of the heat sink 106. Further, the thermal adhesive may also facilitate in sealing any gap formed between the heat generating portion 108 of the circuit board 104 and the heat collecting region 126 of the heat sink 106. Furthermore, the thermal adhesive may also reduce the thermal stress that may have been formed in the heat generating portion 108 of the circuit board 104 due to high temperatures.

[0068] Although examples for the electronic assembly 100 have been described in language specific to structural features and/or methods, it is to be understood that the appended claims are not limited to the specific features described. Rather, the specific features are disclosed as examples of the electronic assembly 100.