Title:
ELECTRONIC CIRCUIT BOARD AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/105465
Kind Code:
A1
Abstract:
In this electronic circuit board of a power conversion device or the like, thermal interference between mounted components is reduced in order to closely arrange the mounted components including a semiconductor element to be mounted on a multilayer printed board and including a magnetic component that is formed by a magnetic core and a coil pattern made of a copper foil of the printed board. When viewed in a direction perpendicular to the main surface of the multilayer printed board, a heat dissipation pattern which is connected to a screw fixing part disposed around the semiconductor element and the coil pattern is provided between and around the semiconductor element and the coil pattern, and the screw fixing part is connected to a cooler so as to provide thermal conductivity and electric conductivity therebetween.
Inventors:
NAKAJIMA KOJI (JP)
SHIRAKATA YUJI (JP)
FUJII KENTA (JP)
SATO SHOTA (JP)
SHIRAKATA YUJI (JP)
FUJII KENTA (JP)
SATO SHOTA (JP)
Application Number:
PCT/JP2017/042886
Publication Date:
June 14, 2018
Filing Date:
November 29, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K3/46; H01F30/10; H02M3/28; H05K1/02; H05K1/16; H05K7/20
Domestic Patent References:
| WO2011010491A1 | 2011-01-27 | |||
| WO2016098538A1 | 2016-06-23 | |||
| WO2014141673A1 | 2014-09-18 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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