Title:
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/049899
Kind Code:
A1
Abstract:
This electronic circuit device is characterized by comprising a wiring layer 13 that is composed of a plurality of metal wiring layers, a photosensitive resin layer 21 that is formed from a photosensitive resin on the wiring layer 13, and a first electronic circuit element 33 that is arranged within the photosensitive resin layer 21. With respect to this electronic circuit device, the photosensitive resin layer 21 is provided with a plurality of openings 41, from which parts of the wiring layer 13 are exposed. This electronic circuit device is also provided with: a rewiring layer 42 on the first electronic circuit element, which is composed of a plurality of metal wiring layers that are three dimensionally connected to the first electronic circuit element 33, while being three dimensionally connected to the parts of the wiring layer 13 through the plurality of openings; and a plurality of first external connection terminals 51 which are connected to the rewiring layer 42.
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Inventors:
AKEJIMA SHUZO (JP)
Application Number:
PCT/JP2018/032904
Publication Date:
March 14, 2019
Filing Date:
September 05, 2018
Export Citation:
Assignee:
RISING TECH CO LTD (JP)
International Classes:
H01L23/12; H05K3/00; H05K3/46
Domestic Patent References:
| WO2010101163A1 | 2010-09-10 |
Foreign References:
| JP2015056458A | 2015-03-23 | |||
| JP2013128060A | 2013-06-27 | |||
| JP2013236105A | 2013-11-21 |
Attorney, Agent or Firm:
TAKAHASHI, HAYASHI AND PARTNER PATENT ATTORNEYS, INC. (JP)
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