Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2021/014681
Kind Code:
A1
Abstract:
An electronic circuit module according to the present invention is provided with a circuit board having a mounting surface on which an electronic component is mounted and a rear surface on which an external connection terminal is provided. The circuit board has: a front-layer ground electrode that is provided on the mounting surface and that has a plurality of front-layer ground patterns; a rear-surface ground electrode that is provided on the rear surface and that has a plurality of rear-surface ground patterns; and a plurality of heat-dissipating vias for connecting the front-layer ground electrode and the rear-surface ground electrode. In a prescribed region of the circuit board in which the front-layer ground electrode and the rear-surface ground electrode overlap each other, each of the plurality of front-layer ground patterns and each of the plurality of rear-surface ground patterns are disposed at mutually overlapping positions. Each of the plurality of heat-dissipating vias is disposed at a position avoiding the front-layer ground patterns and the rear-surface ground patterns.
Inventors:
SATO HIROYUKI (JP)
Application Number:
PCT/JP2020/011502
Publication Date:
January 28, 2021
Filing Date:
March 16, 2020
Export Citation:
Assignee:
ALPS ALPINE CO LTD (JP)
International Classes:
H01L23/12; H05K1/02; H05K9/00
Domestic Patent References:
| WO2017099145A1 | 2017-06-15 |
Foreign References:
| JP2012099682A | 2012-05-24 | |||
| JP2002026468A | 2002-01-25 | |||
| JP2006080168A | 2006-03-23 | |||
| JP2016181575A | 2016-10-13 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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