Title:
ELECTRONIC COMPONENT ACCOMMODATING BODY, AND ELECTRONIC COMPONENT ACCOMMODATING BODY PACKING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/095749
Kind Code:
A1
Abstract:
This electronic component accommodating body comprises a bulk case (2) for accommodating a plurality of electronic components (3), and an RFID tag for identifying the bulk case (2). The RFID tag comprises a base material on which an antenna is formed and on which an RFIC (7) is mounted, and the RFIC (7), wherein the base material is deformable by means of a pressing force from an external structure such as a pin, and a state of connection (present or absent) of the antenna with respect to the RFIC (7), or a gap therebetween, changes in accordance with the deformation of the base material. The present invention thus provides an electronic component accommodating body and an electronic component accommodating body packing material with which, in a bulk case for accommodating electronic components, an RFID communication distance can be changed in accordance with a communication objective.
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Inventors:
ANDO MASAMICHI (JP)
Application Number:
PCT/JP2023/037393
Publication Date:
May 10, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/07; B65D85/86; G06K19/077
Domestic Patent References:
| WO2020079961A1 | 2020-04-23 |
Foreign References:
| JP2022143817A | 2022-10-03 | |||
| JP2022147343A | 2022-10-06 | |||
| JP2011097256A | 2011-05-12 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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