Title:
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/057504
Kind Code:
A1
Abstract:
Disclosed by the embodiments of the present application are an electronic component and an electronic device, said electronic component being arranged on a printed circuit board (PCB), the electronic component comprising: an electronic component main body, said electronic component main body being soldered to the PCB by means of a connecting member, the connecting member being provided with at least one cushioning structure. Hence, by means of arranging at least one cushioning structure on the connecting member, when the electronic component is subjected to mechanical stress, the stress can be relieved at the location of the cushioning structure, reducing the stress on the electronic component main body, avoiding breakage of the electronic component main body under stress, and improving the reliability of the electronic component.
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Inventors:
SHI HONGBIN (CN)
Application Number:
PCT/CN2021/111022
Publication Date:
March 24, 2022
Filing Date:
August 05, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01G4/224; H01G4/232
Foreign References:
| JP2001126950A | 2001-05-11 | |||
| CN101740220A | 2010-06-16 | |||
| CN102907187A | 2013-01-30 | |||
| CN109559894A | 2019-04-02 | |||
| US20160126015A1 | 2016-05-05 | |||
| CN202022071522U | 2020-09-18 |
Other References:
See also references of EP 4210077A4
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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