Title:
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/176074
Kind Code:
A1
Abstract:
The present invention provides an electronic component that can be colored without the need for a dedicated furnace and a manufacturing method for the electronic component. A case 11 is formed from a resin material. A cover 12 is formed from the resin material including an oxide layer 12b on the surface, is attached to the case, and includes an opening 12a. A rotor 14 is disposed in the case, and includes an operation section 14a exposed from the opening in the cover. The cover has a color different from that of the rotor.
Inventors:
KOMURO TADASHI (JP)
Application Number:
PCT/JP2022/046457
Publication Date:
September 21, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
NIDEC COPAL ELECTRONICS CORP (JP)
International Classes:
H01H9/02; B29C65/16; H01H19/02; H01H19/04; H05K5/00
Foreign References:
| JP2015225808A | 2015-12-14 | |||
| JP2013093154A | 2013-05-16 | |||
| JP2009214559A | 2009-09-24 | |||
| JP2009181945A | 2009-08-13 | |||
| JP2006165351A | 2006-06-22 | |||
| JP2016066452A | 2016-04-28 | |||
| JP2003197085A | 2003-07-11 |
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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